{"id":3362,"date":"2024-10-08T09:02:01","date_gmt":"2024-10-08T07:02:01","guid":{"rendered":"https:\/\/ikv-aachen.de\/rp\/nsf-dfg-quantitative-untersuchungen-der-tapeanbindung-in-hinterspritzten-thermoplastischen-bauteilen-mittels-datenphysikalischer-multiskalenmethoden\/"},"modified":"2025-05-14T10:54:33","modified_gmt":"2025-05-14T08:54:33","slug":"nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods","status":"publish","type":"cpt_ikv_rp","link":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/","title":{"rendered":"NSF-DFG &#8211; Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods"},"content":{"rendered":"<style type=\"text\/css\">\n    #single-header-block_b5e80747812f2ef66ac409da69670fda .swiperThumbsNavi .swiper-slide {\n        opacity: 0.4;\n    }\n\n    #single-header-block_b5e80747812f2ef66ac409da69670fda .swiperThumbsNavi .swiper-slide-thumb-active {\n        opacity: 1;\n    }\n<\/style>\n    <section id=\"single-header-block_b5e80747812f2ef66ac409da69670fda\" class=\"block-single-header theGridWrapper \">\n        <div class=\"theGrid12\">\n            <div class=\" col-start-2 col-span-10 md:col-start-3  md:col-span-8\">\n                <h2 class=\"font-serif font-semibold text-blue text-sm w-4\/5\">\n                    Multiscale methods for analyzing tape adhesion in overmolded thermoplastic components                <\/h2>\n                                    <div class=\"mt-base text-blue text-sm font border-l-8  border-blue pl-base my-12 leading-normal \">\n                        The DFG and NSF-funded project focuses on microcrystallization and diffusion processes. The aim is to develop data-driven simulation models to accurately calculate the bond strength between thermoplastic UD tapes and short fiber-reinforced injection molding material on a macroscopic scale.                    <\/div>\n                                            <\/div>\n        <\/div>\n    <\/section>\n\n\n<figure class=\" relative flex flex-col gap-2xs mb-xs md:mb-l xl:mb-xl\"><img decoding=\"async\"  class=\" w-full  \"  src=\"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1.jpg\" srcset=\"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1-748x507.jpg 748w, https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1-1536x1040.jpg 1536w, https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1-768x520.jpg 768w\" sizes=\"auto, (max-width: 1536px) 100vw, 1536px\" width=\"1536\" height=\"1040\" alt=\"NSF-DFG eng\" loading=\"lazy\" \/><span class=\" text-copyright order-3 justify-end text-right w-full  w-full \">&copy; IKV<\/span><figcaption class=\" w-full  text-figcaption justify-end text-right \">In the scope of the project, a critical molecular-level understanding of interfaces in overmolded thermoplastic parts will be developed.<\/figcaption><\/figure>\n\n\n<p class=\"wp-block-paragraph\">Local reinforcements in injection-moulded components for mass-market applications with thermoplastic glass or carbon fibre tapes can improve structural performance while also enabling significant savings in compound material. As part of the ongoing research project &#8220;Tape Technology Transfer Hub: T3-Hub&#8221;, it has already been demonstrated that the use of this technology can achieve practical savings in the double-digit percentage range in terms of component weight, material costs and CO<sub>2<\/sub> emissions. This opens up a new, economically viable and environmentally friendly design approach for injection moulded components. However, investigations at the component level have shown that the stress concentrations that occur resulting from the stiffness gradients between the injection moulding compound and the tape reinforcement induce high stresses on the interface between these materials and can therefore cause premature component failure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In cooperation with two research groups from Columbia University, New York, and a research group from the University of Wuppertal, the Institute of Plastics Processing, together with General Motors and the Sandia National Laboratory, will be working on the research project &#8220;Multiscale data-physical models for the critical role of interfaces in back-injected thermoplastic components&#8221; over the next three years. The project, funded by the German Research Foundation (DFG) and the National Science Foundation (NSF), is focusing on the investigation of crystallisation and diffusion processes at the micro level for the study of macro-scale data-driven simulation models for calculating the bonding strength of the interface between thermoplastic UD tapes and short-fibre-reinforced injection moulding compounds.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">As part of the project, IKV is responsible for the integrative simulation chains and is specialising in innovative measurement and characterisation methods for the spatially resolved bond strength at test specimen and demonstrator level. In this way, the numerical and data-driven simulation methods to be developed are calibrated and made available for integration into multi-scale simulations for component and process optimisation. In future, this will enable the material-specific design of parts and manufacturing processes for tape-reinforced injection moulded components.<\/p>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\"><summary>Project data and funding<\/summary><section id=\"logo-bar-block_b99b3332d38a6d0bc0c6f4aec92aad29\" class=\"block-logo-bar py-2xl  clear-both\">\n    <div class=\"theGridWrapper overflow-hidden  \">\n        <div class=\"grid grid-cols-[repeat(auto-fill,minmax(140px,1fr))] gap-base\">\n                            <figure class=\" relative h-full  \"><img decoding=\"async\" fetchpriority=\"low\"  class=\" object-contain w-full h-full mb-base  \"  src=\"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/12\/Logo-DFG.png\" srcset=\"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/12\/Logo-DFG-748x591.png 748w\" sizes=\"auto, (max-width: 748px) 100vw, 748px\" width=\"748\" height=\"591\" alt=\"Logo-DFG\" loading=\"lazy\" \/><\/figure>                                <\/div>\n    <\/div>\n<\/section>\n<\/details>\n\n\n\n<h2 class=\"wp-block-heading\">Keywords<\/h2>\n","protected":false},"excerpt":{"rendered":"<p>The DFG and NSF-funded project focuses on microcrystallization and diffusion processes. The aim is to develop data-driven simulation models to accurately calculate the bond strength between thermoplastic UD tapes and short fiber-reinforced injection molding material on a macroscopic scale.<\/p>\n","protected":false},"featured_media":3179,"parent":0,"template":"","tags":[1033,921,868,846],"research_fields":[809,834,813,810],"class_list":["post-3362","cpt_ikv_rp","type-cpt_ikv_rp","status-publish","has-post-thumbnail","hentry","tag-back-injection-back-molding","tag-injection-moulding","tag-leightweight-technologies","tag-multi-scale-simulation","research_fields-fiber-reinforced-plastics","research_fields-hydrogen-technologies","research_fields-injection-moulding","research_fields-lightweight-technologies"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>NSF-DFG - Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods | IKV-Aachen<\/title>\n<meta name=\"description\" content=\"The DFG and NSF-funded project focuses on microcrystallization and diffusion processes. The aim is to develop data-driven simulation models to accurately calculate the bond strength between thermoplastic UD tapes and short fiber-reinforced injection molding material on a macroscopic scale.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"NSF-DFG - Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods | IKV-Aachen\" \/>\n<meta property=\"og:description\" content=\"The DFG and NSF-funded project focuses on microcrystallization and diffusion processes. The aim is to develop data-driven simulation models to accurately calculate the bond strength between thermoplastic UD tapes and short fiber-reinforced injection molding material on a macroscopic scale.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/\" \/>\n<meta property=\"og:site_name\" content=\"IKV-Aachen\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/profile.php?id=523026911193540&amp;_rdr\" \/>\n<meta property=\"article:modified_time\" content=\"2025-05-14T08:54:33+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1865\" \/>\n\t<meta property=\"og:image:height\" content=\"1263\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/rp\\\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\\\/\",\"url\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/rp\\\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\\\/\",\"name\":\"NSF-DFG - Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods | IKV-Aachen\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/rp\\\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/rp\\\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/ikv-aachen.de\\\/wp-content\\\/uploads\\\/2024\\\/10\\\/HO4776_85-1.jpg\",\"datePublished\":\"2024-10-08T07:02:01+00:00\",\"dateModified\":\"2025-05-14T08:54:33+00:00\",\"description\":\"The DFG and NSF-funded project focuses on microcrystallization and diffusion processes. The aim is to develop data-driven simulation models to accurately calculate the bond strength between thermoplastic UD tapes and short fiber-reinforced injection molding material on a macroscopic scale.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/rp\\\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\\\/#breadcrumb\"},\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/rp\\\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/rp\\\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\\\/#primaryimage\",\"url\":\"https:\\\/\\\/ikv-aachen.de\\\/wp-content\\\/uploads\\\/2024\\\/10\\\/HO4776_85-1.jpg\",\"contentUrl\":\"https:\\\/\\\/ikv-aachen.de\\\/wp-content\\\/uploads\\\/2024\\\/10\\\/HO4776_85-1.jpg\",\"width\":1865,\"height\":1263,\"caption\":\"In the scope of the project, a critical molecular-level understanding of interfaces in overmolded thermoplastic parts will be developed.\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/rp\\\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"NSF-DFG &#8211; Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/#website\",\"url\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/\",\"name\":\"IKV-Aachen\",\"description\":\"Forschung f\u00fcr die Praxis\",\"publisher\":{\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/#organization\"},\"alternateName\":\"Institut f\u00fcr Kunststoffverarbeitung\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-GB\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/#organization\",\"name\":\"IKV-Aachen\",\"alternateName\":\"Institut f\u00fcr Kunststoffverarbeitung (IKV)\",\"url\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/ikv-aachen.de\\\/wp-content\\\/uploads\\\/2025\\\/02\\\/ikv-ikv-1.png\",\"contentUrl\":\"https:\\\/\\\/ikv-aachen.de\\\/wp-content\\\/uploads\\\/2025\\\/02\\\/ikv-ikv-1.png\",\"width\":512,\"height\":512,\"caption\":\"IKV-Aachen\"},\"image\":{\"@id\":\"https:\\\/\\\/ikv-aachen.de\\\/en\\\/#\\\/schema\\\/logo\\\/image\\\/\"},\"sameAs\":[\"https:\\\/\\\/www.facebook.com\\\/profile.php?id=523026911193540&_rdr\",\"https:\\\/\\\/www.instagram.com\\\/ikvaachen\\\/\"]}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"NSF-DFG - Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods | IKV-Aachen","description":"The DFG and NSF-funded project focuses on microcrystallization and diffusion processes. The aim is to develop data-driven simulation models to accurately calculate the bond strength between thermoplastic UD tapes and short fiber-reinforced injection molding material on a macroscopic scale.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/","og_locale":"en_GB","og_type":"article","og_title":"NSF-DFG - Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods | IKV-Aachen","og_description":"The DFG and NSF-funded project focuses on microcrystallization and diffusion processes. The aim is to develop data-driven simulation models to accurately calculate the bond strength between thermoplastic UD tapes and short fiber-reinforced injection molding material on a macroscopic scale.","og_url":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/","og_site_name":"IKV-Aachen","article_publisher":"https:\/\/www.facebook.com\/profile.php?id=523026911193540&_rdr","article_modified_time":"2025-05-14T08:54:33+00:00","og_image":[{"width":1865,"height":1263,"url":"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1.jpg","type":"image\/jpeg"}],"twitter_card":"summary_large_image","twitter_misc":{"Estimated reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/","url":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/","name":"NSF-DFG - Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods | IKV-Aachen","isPartOf":{"@id":"https:\/\/ikv-aachen.de\/en\/#website"},"primaryImageOfPage":{"@id":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/#primaryimage"},"image":{"@id":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/#primaryimage"},"thumbnailUrl":"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1.jpg","datePublished":"2024-10-08T07:02:01+00:00","dateModified":"2025-05-14T08:54:33+00:00","description":"The DFG and NSF-funded project focuses on microcrystallization and diffusion processes. The aim is to develop data-driven simulation models to accurately calculate the bond strength between thermoplastic UD tapes and short fiber-reinforced injection molding material on a macroscopic scale.","breadcrumb":{"@id":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/#breadcrumb"},"inLanguage":"en-GB","potentialAction":[{"@type":"ReadAction","target":["https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/"]}]},{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/#primaryimage","url":"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1.jpg","contentUrl":"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2024\/10\/HO4776_85-1.jpg","width":1865,"height":1263,"caption":"In the scope of the project, a critical molecular-level understanding of interfaces in overmolded thermoplastic parts will be developed."},{"@type":"BreadcrumbList","@id":"https:\/\/ikv-aachen.de\/en\/rp\/nsf-dfg-quantitative-analysis-of-tape-adhesion-in-back-moulded-thermoplastic-components-using-data-physical-multiscale-methods\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/ikv-aachen.de\/en\/"},{"@type":"ListItem","position":2,"name":"NSF-DFG &#8211; Quantitative analysis of tape adhesion in back-moulded thermoplastic components using data-physical multiscale methods"}]},{"@type":"WebSite","@id":"https:\/\/ikv-aachen.de\/en\/#website","url":"https:\/\/ikv-aachen.de\/en\/","name":"IKV-Aachen","description":"Forschung f\u00fcr die Praxis","publisher":{"@id":"https:\/\/ikv-aachen.de\/en\/#organization"},"alternateName":"Institut f\u00fcr Kunststoffverarbeitung","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/ikv-aachen.de\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-GB"},{"@type":"Organization","@id":"https:\/\/ikv-aachen.de\/en\/#organization","name":"IKV-Aachen","alternateName":"Institut f\u00fcr Kunststoffverarbeitung (IKV)","url":"https:\/\/ikv-aachen.de\/en\/","logo":{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/ikv-aachen.de\/en\/#\/schema\/logo\/image\/","url":"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2025\/02\/ikv-ikv-1.png","contentUrl":"https:\/\/ikv-aachen.de\/wp-content\/uploads\/2025\/02\/ikv-ikv-1.png","width":512,"height":512,"caption":"IKV-Aachen"},"image":{"@id":"https:\/\/ikv-aachen.de\/en\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.facebook.com\/profile.php?id=523026911193540&_rdr","https:\/\/www.instagram.com\/ikvaachen\/"]}]}},"_links":{"self":[{"href":"https:\/\/ikv-aachen.de\/en\/wp-json\/wp\/v2\/rp\/3362","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ikv-aachen.de\/en\/wp-json\/wp\/v2\/rp"}],"about":[{"href":"https:\/\/ikv-aachen.de\/en\/wp-json\/wp\/v2\/types\/cpt_ikv_rp"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ikv-aachen.de\/en\/wp-json\/wp\/v2\/media\/3179"}],"wp:attachment":[{"href":"https:\/\/ikv-aachen.de\/en\/wp-json\/wp\/v2\/media?parent=3362"}],"wp:term":[{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ikv-aachen.de\/en\/wp-json\/wp\/v2\/tags?post=3362"},{"taxonomy":"research_fields","embeddable":true,"href":"https:\/\/ikv-aachen.de\/en\/wp-json\/wp\/v2\/research_fields?post=3362"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}